Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
著者
書誌事項
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
(Electronic packaging and interconnection series)
McGraw-Hill, c1997
- : hc
大学図書館所蔵 件 / 全1件
-
該当する所蔵館はありません
- すべての絞り込み条件を解除する
注記
Includes bibliographical references and index
内容説明・目次
内容説明
Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
目次
Introduction.Reliability Testing and Data Analysis.Failure Analysis.Design for Reliability.Solder Joint Reliability of BGA Assemblies.Solder Joint Reliability of Flip Chip Assemblies.Solder Joint Reliability of CSP.Solder Joint Reliability of Fine Pitch SMT Assemblies.
「Nielsen BookData」 より