Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A.
著者
書誌事項
Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A.
（Materials Research Society symposium proceedings, v. 445）
Materials Research Society, c1997
- タイトル別名
-
Electronic packaging materials science 9
Electronic packaging materials science nine
大学図書館所蔵 件 / 全5件
-
該当する所蔵館はありません
- すべての絞り込み条件を解除する
注記
Includes bibliographical references and indexes
内容説明・目次
内容説明
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
「Nielsen BookData」 より
