ISTFA '93 : proceedings of the 19th International Symposium for Testing and Failure Analysis, 15-19 November 1993, Los Angeles, California

Author(s)

• International Symposium for Testing and Failure Analysis
• ASM International. Electronic Materials and Processing Division

Bibliographic Information

ISTFA '93 : proceedings of the 19th International Symposium for Testing and Failure Analysis, 15-19 November 1993, Los Angeles, California

sponsored by the Electronic Materials and Processing Division of ASM International

ASM International, c1993

Details

• NCID: BA36548581
• ISBN:
  • 0871704986
• LCCN: 97073500
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Materials Park, OH
• Pages/Volumes: xi, 436 p.
• Size: 28 cm
• Classification:
  • LCC : TK7871
  • DC20 : 621.381/04
• Subject Headings:
  • LCSH : Electronics -- Materials -- Testing -- Congresses
  • LCSH : Electronic appartus and appliances -- Testing -- Congresses