Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A.
著者
書誌事項
Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A.
（Materials Research Society symposium proceedings, v. 505）
Materials Research Society, c1998
- タイトル別名
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Thin films - stresses and mechanical properties VII
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注記
Includes bibliographical references and indexes
内容説明・目次
内容説明
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
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