1998 IEEE International Reliability Physics Symposium proceedings : 36th annual, Reno, Nevada, March 31, April 1, 2, 1998

書誌事項

1998 IEEE International Reliability Physics Symposium proceedings : 36th annual, Reno, Nevada, March 31, April 1, 2, 1998

sponsored by the IEEE Electron Devices Society and the IEEE Reliability Society

Institute of Electrical and Electronics Engineers, c1998

  • : soft.
  • : case.

タイトル別名

98CH36173

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注記

Includes bibliographies

"IEEE Catalog No. 98CH36173"

内容説明・目次

内容説明

This text deals with physical mechanisms that reduce the reliability or performance of integrated circuits and microelectronics. It covers such topics as: advanced semiconductor devices; failure and yield enhancement analysis; device dielectrics; channel hot carriers; and ESD and latchup.

「Nielsen BookData」 より

詳細情報

  • NII書誌ID(NCID)
    BA37509756
  • ISBN
    • 0780344006
    • 0780344014
  • LCCN
    82640313
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Piscataway, N. J.
  • ページ数/冊数
    vii, 421 p.
  • 大きさ
    28 cm
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