Grain boundary diffusion and grain boundary segregation : proceedings of the International Workshop : DiBoS-97, held in Moscow, Russia, May 1997
著者
書誌事項
Grain boundary diffusion and grain boundary segregation : proceedings of the International Workshop : DiBoS-97, held in Moscow, Russia, May 1997
（Diffusion and defect data : solid state data, pt. A . Defect and diffusion forum ; v. 156）
Scitec Publications, c1998
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内容説明・目次
内容説明
The phenomena of grain boundary diffusion and grain boundary segregation play major roles in determining the properties and behavior of a wide variety of materials. Even though the basic principles have been known for a long time, the field continues to yield a number of very challenging questions.
目次
Grain Boundary Diffusion and Oxidation Processes
Influence of Grain Boundary Diffusion on Thin Film Reactions
Motion of the Grain Boundary System with the Triple Junctions
Study of Grain-Boundary Diffusion of Au in Copper within 5 Misorientation Range in the Context of Structure of Grain Boundaries
Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size
Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250 DegreesC
Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product
Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper
Grain Boundary Diffusion and Stability of the Triple Junctions
A New Method for Grain Boundary Diffusion Coefficient Measurement
Complex Atomic-Scale Dynamics in Grain Boundaries in Silicon
Relation Between Segregation at Interfaces, Structure and Diffusion in Germanium
Microscopic Investigation of Surface Segregation in Random Alloys
Segregation, Phase Separation and Grain Boundary Diffusion in Thin Films
AES Study of the Mass Transport of Nickel Near Ni / Cu (111) Interface
Grain Boundary Segregation in the Cu-Bi System
Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects
Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy
The Effect of Pressure on Grain Boundary Wetting, Segregation and Diffusion
Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals
Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach
The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals
The Study of the Diffusion of 57Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
Exact Solution of Triple Junction Diffusion Problem
Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
Growth and Healing of Voids at Grain Boundary during High Temperature Creep
Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds
Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C'
Round Table Discussion I: Diffusion in Intermetallics
Round Table Discussion II: Grain Boundary Wetting and Liquid Grooving
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