Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.
著者
書誌事項
Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.
（Materials Research Society symposium proceedings, v. 515）
Materials Research Society, c1998
- タイトル別名
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Electronic packaging materials science 10
Electronic packaging materials science ten
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注記
Includes bibliographical references and indexes
内容説明・目次
内容説明
Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.
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