Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.

著者

• Murarka, S. P.

書誌事項

Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.

editors, Shyam P. Murarka ... [et al.]

（Materials Research Society symposium proceedings, 514）

Materials Research Society, c1998

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA38805539
• ISBN:
  • 1558994203
• LCCN: 98039943
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Warrendale, Pa.
• ページ数/冊数: xvi, 560p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials -- Congresses
  • LCSH : Integrated circuits -- Materials -- Congresses
  • LCSH : Semiconductors -- Congresses
• 親書誌ID:
  • BA00013775