Proceedings : 3rd International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 9-12, 1997

著者

• International Symposium on Advanced Packaging Materials (3rd : 1997 : Braselton, Georgia)
• Tummala, Rao
• International Microelectronics and Packaging Society

書誌事項

Proceedings : 3rd International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 9-12, 1997

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, Rao, Tummala

IMAPS , IEEE, [1997]

タイトル別名

3rd International Symposium and Exhibition on Advanced Packaging Materials

注記

IEEE catalog number 97TH8263

Includes bibliographical references and author index

詳細情報

• NII書誌ID(NCID): BA39931801
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Reston, Virginia,Piscataway, New Jersey
• ページ数/冊数: 183 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials -- Congresses