Semiconductor wafer bonding : science and technology

Author(s)

• Tong, Q.-Y
• Gösele, U.

Bibliographic Information

Semiconductor wafer bonding : science and technology

Q. -Y. Tong, U. Gösele

（The Electrochemical Society series）

John Wiley, c1999

Note

Includes index

Details

• NCID: BA41392663
• ISBN:
  • 0471574813
• LCCN: 98024397
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xviii, 297 p.
• Size: 24 cm
• Classification:
  • LCC : TK7871.85
  • DC21 : 621.3815/2
• Subject Headings:
  • LCSH : Semiconductors -- Bonding
  • LCSH : Semiconductor wafers
• Parent Bibliography ID:
  • BA04442376