Mechanical analysis of electronic packaging systems
Author(s)
Bibliographic Information
Mechanical analysis of electronic packaging systems
（Mechanical engineering, 120）
Marcel Dekker, c1999
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Table of Contents
- Analytical tools
- thermal performance analysis
- mechanical performance analysis
- life analysis
- other analysis
- analysis of test data
- reporting and verification.
by "Nielsen BookData"
