Mechanical analysis of electronic packaging systems
著者
書誌事項
Mechanical analysis of electronic packaging systems
(Mechanical engineering, 120)
Marcel Dekker, c1999
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
目次
- Analytical tools
- thermal performance analysis
- mechanical performance analysis
- life analysis
- other analysis
- analysis of test data
- reporting and verification.
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