Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes

Author(s)

• International Symposium on Thin Film Materials, Processes, Reliability, and Applications: Thin Film Processes
• Mathad, G. S.
• Meyyappan, M.
• Engelhardt, M. (Michael)
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division
• Electrochemical Society. Electrodeposition Division
• Electrochemical Society. Meeting
• International Society of Electrochemistry. Meeting

Bibliographic Information

Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes

editors, G.S. Mathad, M. Meyyappan, M. Engelhardt ; Dielectric Science & Technology, Electronics, and Electrodeposition Divisions

（Proceedings / [Electrochemical Society], v. 97-30）

Electrochemical Society, c1998

Other Title

Thin film materials, processes, reliability, and applications: thin film processes

Note

"Held as a part of the Joint International Meeting of the Electrochemical Society, Inc. and the International Society for Electrochemistry in Paris, France, Aug. 31-Sept. 5, 1997"--P. iii

Includes bibliographical references and indexes

• NCID: BA43162777
• ISBN:
  • 1566771838
• LCCN: 98158683
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: ix, 370 p.
• Size: 23 cm
• Classification:
  • LCC : TK7872.T55
  • DC21 : 621.3815/2
• Subject Headings:
  • LCSH : Thin film devices -- Design and construction -- Congresses
  • LCSH : Thin films -- Congresses
  • LCSH : Plasma etching -- Congresses
• Parent Bibliography ID:
  • BA01323290