Failure analysis of integrated circuits : tools and techniques

著者

書誌事項

Failure analysis of integrated circuits : tools and techniques

edited by Lawrence C. Wagner

Kluwer Academic Publishers, c1999

大学図書館所蔵 件 / 全9件

この図書・雑誌をさがす

注記

"SECS 494"--P. [4] of cover

Includes bibliographical references and index

内容説明・目次

内容説明

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

目次

  • Preface. 1. Introduction
  • L.C. Wagner. 2. Electrical Characterization
  • S. Frank, et al. 3. Package Analysis: SAM and X-Ray
  • T.M. Moore, C. Hartfield. 4. Die Exposure
  • P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques
  • D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques
  • E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis
  • C.G. Talbot. 8. Deprocessing
  • D. Yim. 9. Cross-Section Analysis
  • T. Haddock, S. Boddicker. 10. Inspection Techniques
  • L.C. Wagner. 11. Chemical Analysis
  • L.C. Wagner. 12. Energy Dispersive Spectroscopy
  • P.D. Ngo. 13. Auger Electron Spectroscopy
  • R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS
  • K. Evans. 15. Failure Analysis Future Requirements
  • D.P. Vallett. Index.

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