Proceedings of the 1997 1st Electronic Packaging Technology Conference

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書誌事項

Proceedings of the 1997 1st Electronic Packaging Technology Conference

edited by Andrew A.O. Tay ; organised by IEEE CPMT Singapore Chapter ; technically co-sponsored by IEEE CPMT Society ; sponsored by Institute of Materials Research and Engineering, Institute of Microelectronics

Institute of Electrical and Electronics Engineers, c1997

タイトル別名

97TH8307

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注記

"IEEE catalog no. 97TH8307"--Cover

Includes bibliographical references

内容説明・目次

内容説明

This text covers the 1997 Electronic Packaging Conference, which discussed packaging structures for performance-driven, high-speed and high complexity electronic systems. It includes such topics as: package design issues; on-chip interconnection issues; and switching systems.

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