Proceedings of the 1997 1st Electronic Packaging Technology Conference
著者
書誌事項
Proceedings of the 1997 1st Electronic Packaging Technology Conference
Institute of Electrical and Electronics Engineers, c1997
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97TH8307
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注記
"IEEE catalog no. 97TH8307"--Cover
Includes bibliographical references
内容説明・目次
内容説明
This text covers the 1997 Electronic Packaging Conference, which discussed packaging structures for performance-driven, high-speed and high complexity electronic systems. It includes such topics as: package design issues; on-chip interconnection issues; and switching systems.
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