Molecular self-assembly organic versus inorganic approaches

書誌事項

Molecular self-assembly organic versus inorganic approaches

volume editor: M. Fujita ; with contributions by I. Bernt ... [et al.]

(Structure and bonding, 96)

Springer, c2000

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注記

Includes bibliographical references and index

内容説明・目次

内容説明

Self-assembly is undoubtedly a topic of special interest in current chemistry and is related to very wide scientific areas. Recent progress in this field seems to be featured by the construction of well-defined discrete systems exploiting complementary hydrogen bonding as well as coordination bonding. Seven leading international experts introduce the current topics in this very interesting field, focusing on two major subjects: organic assemblies and inorganic assemblies. All researchers who are interested in molecular recognition, material science, nanotechnology, and supramolecular chemistry will welcome this book as an inspiring source for creative research ideas.

目次

Organic Assemblies.- The Utilization of Persistent H-Bonding Motifs in the Self-Assembly of Supramolecular Architectures.- Controlling Hydrogen Bonding: From Molecular Recognition to Organogelation.- Heteroaromatic Modules for Self-Assembly Using Multiple Hydrogen Bonds.- Hydrogen-Bonded Liquid Crystals: Molecular Self-Assembly for Dynamically Functional Materials.- Inorganic Assemblies.- Synergistic Effect of Serendipity and Rational Design in Supramolecular Chemistry.- Molecular Paneling Through Metal-Directed Self-Assembly.- Pythagorean Harmony in the World of Metal Oxygen Clusters of the Mo11 Type: Giant Wheels and Spheres both Based on a Pentagonal Type Unit.

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  • Structure and bonding

    Springer-Verlag

    v. 1 : gw , v. 2 : gw , v. 3 : gw , v. 4 : gw , v. 5 : gw , v. 6 : gw , v. 7 : gw , v. 8 : gw , v. 8 : us , v. 9 : gw , v. 9 : us

    所蔵館39館

詳細情報

  • NII書誌ID(NCID)
    BA47023499
  • ISBN
    • 3540669485
  • 出版国コード
    gw
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Berlin ; Heidelberg ; New York
  • ページ数/冊数
    254 p.
  • 大きさ
    24 cm
  • 親書誌ID
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