Composite materials for electronic functions
Author(s)
Bibliographic Information
Composite materials for electronic functions
(Materials science foundations, 12)
Trans Tech Publications, c2000
Available at 3 libraries
  Aomori
  Iwate
  Miyagi
  Akita
  Yamagata
  Fukushima
  Ibaraki
  Tochigi
  Gunma
  Saitama
  Chiba
  Tokyo
  Kanagawa
  Niigata
  Toyama
  Ishikawa
  Fukui
  Yamanashi
  Nagano
  Gifu
  Shizuoka
  Aichi
  Mie
  Shiga
  Kyoto
  Osaka
  Hyogo
  Nara
  Wakayama
  Tottori
  Shimane
  Okayama
  Hiroshima
  Yamaguchi
  Tokushima
  Kagawa
  Ehime
  Kochi
  Fukuoka
  Saga
  Nagasaki
  Kumamoto
  Oita
  Miyazaki
  Kagoshima
  Okinawa
  Korea
  China
  Thailand
  United Kingdom
  Germany
  Switzerland
  France
  Belgium
  Netherlands
  Sweden
  Norway
  United States of America
Note
Bibliography: p. 58-77
Description and Table of Contents
Description
Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.
Table of Contents
Contents
1. Preface. Introduction. 2. Non-Structuralcomposite Materials for Electronic Functions
2.1 Backgroundon Electronic Packaging
2.2 Polymer-Matrix Composites
2.3 Metal-Matrixcomposites
2.4 Carbon-Matrix Composites
2.5 Ceramic-Matrixcomposites
3. Structuralcomposite Materials for Electronic Functions
3.1 Cement-Matrixcomposites for Smart Structures
3.2 Polymer-Matrix Composites for Smartstructures
4. Conclusion
Acknowledgement and References
by "Nielsen BookData"