Composite materials for electronic functions

Bibliographic Information

Composite materials for electronic functions

D.D.L. Chung

(Materials science foundations, 12)

Trans Tech Publications, c2000

Available at  / 3 libraries

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Note

Bibliography: p. 58-77

Description and Table of Contents

Description

Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.

Table of Contents

Contents 1. Preface. Introduction. 2. Non-Structuralcomposite Materials for Electronic Functions 2.1 Backgroundon Electronic Packaging 2.2 Polymer-Matrix Composites 2.3 Metal-Matrixcomposites 2.4 Carbon-Matrix Composites 2.5 Ceramic-Matrixcomposites 3. Structuralcomposite Materials for Electronic Functions 3.1 Cement-Matrixcomposites for Smart Structures 3.2 Polymer-Matrix Composites for Smartstructures 4. Conclusion Acknowledgement and References

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Details

  • NCID
    BA47071786
  • ISBN
    • 0878498362
  • Country Code
    sz
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Uetikon-Zuerich, Switzerland
  • Pages/Volumes
    77 p.
  • Size
    25 cm
  • Parent Bibliography ID
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