Wire bonding in microelectronics : materials, processes, reliability, and yield
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Bibliographic Information
Wire bonding in microelectronics : materials, processes, reliability, and yield
（Electronic packaging and interconnection series）
McGraw-Hill, c1997
2nd ed
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Note
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
Includes bibliographical references and index
