Wire bonding in microelectronics : materials, processes, reliability, and yield
著者
書誌事項
Wire bonding in microelectronics : materials, processes, reliability, and yield
（Electronic packaging and interconnection series）
McGraw-Hill, c1997
2nd ed
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注記
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
Includes bibliographical references and index
内容説明・目次
内容説明
This is the classic reference on wire bonding - expanded and updated! "Wire Bonding in Microelectronics Second Edition" the definitive single-volume reference on wire bonding just got better - in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies. Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published.Readers will learn to: understand the bonding technology; test wire bonds; make reliable bonds at a very high yield; bond wires to multichip modules; solve common bonding problems; evaluate alternative bonding technologies; and, improve bondability and reliability via more effective cleaning techniques.
目次
Technical Introduction to the Second Edition.Ultrasonic Bonding Systems and Technologies (Including Ultrasonic Wire Bonding Mechanism).Some Aspects of Bonding Wire Characteristics That can Affect Bonding, Reliability, or Testing.Wire Bond Testing.Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions Encountered in Wire Bonding.Bond Failures Resulting from Gold-Plating Impurities and Conditions.Cleaning to Improve Bondability and Reliability.Mechanical Problems in Wire Bonding.High-Yield and Fine-Pitch Wire Bonding.Wire Bonding to Multichip Modules and Other Soft Substrates.Glossary.Index.
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