Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]
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Bibliographic Information
Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]
Institute of Electrical and Electronics Engineers, c1997
- softbound
- Other Title
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6th International Symposium on the Physical & Failure Analysis of Integrated Circuites
6th International Symposium on the Physical & Failure Analysis of Integrated Circuits 1997
IPFA '97
97TH8289
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"IPFA '97 proceedings"--Cover
"IEEE catalog number 97TH8289"
Includes bibliographic references and author index
Description and Table of Contents
Description
Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.
by "Nielsen BookData"