Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

著者

• International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
• Kivilahti, Jorma
• Hyytiäinen, Marika
• NOKIA

書誌事項

Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

conference chair, Jorma Kivilahti ; proceedings editor, Marika Hyytiäinen ; sponsored by NOKIA ... [et al.]

IEEE, c2000

タイトル別名

Adhesives in Electronics 2000

注記

Includes bibliographical references

内容説明・目次

内容説明

This work contains the proceedings of the Fourth International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing. The papers cover: novel applications; reliability; high density substrates; materials development; ICA performance; and more.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA49551931
• ISBN:
  • 0780364600
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Piscataway, New Jersey
• ページ数/冊数: xii, 319 p.
• 大きさ: 29 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging Congresses
  • LCSH : Electronic packaging -- Materials Congresses
  • LCSH : Adhesive joints Congresses
  • LCSH : Coating processes Congresses