Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

Author(s)

• International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
• Kivilahti, Jorma
• Hyytiäinen, Marika
• NOKIA

Bibliographic Information

Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

conference chair, Jorma Kivilahti ; proceedings editor, Marika Hyytiäinen ; sponsored by NOKIA ... [et al.]

IEEE, c2000

Other Title

Adhesives in Electronics 2000

Note

Includes bibliographical references

Description and Table of Contents

Description

This work contains the proceedings of the Fourth International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing. The papers cover: novel applications; reliability; high density substrates; materials development; ICA performance; and more.

by "Nielsen BookData"

Details

• NCID: BA49551931
• ISBN:
  • 0780364600
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Piscataway, New Jersey
• Pages/Volumes: xii, 319 p.
• Size: 29 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging Congresses
  • LCSH : Electronic packaging -- Materials Congresses
  • LCSH : Adhesive joints Congresses
  • LCSH : Coating processes Congresses