Electronic packaging and interconnection handbook
Author(s)
Bibliographic Information
Electronic packaging and interconnection handbook
（McGraw-Hill handbooks）（Electronic packaging and interconnection series）
McGraw-Hill, c2000
3rd ed
Available at 3 libraries
Note
"Electronic packaging & production"--Cover
Includes bibliographical references and index
Description and Table of Contents
Description
This edition features new material covering the new generation of packaging technologies transforming the industry.
Table of Contents
Materials for Electronic Packaging. Thermal Management in Electronic Packaging. Mechanical and Thermomechanical Stress Behavior in Electronic Packaging. Connector and Interconnection Technology. Wiring and Cabling. Soldering and Solder Technology. Integrated Circuit Packaging and Ball Grid Arrays. Surface Mount Technologies. Hybrid Microelectronic and Multichip Module Packaging. Chip Scale Packaging and Direct Chip Attach Technologies. Rigid and Flexible Printed Wiring Boards. Packaging of High Speed and Microwave Electronic Systems. Packaging of High Voltage Electronic Systems.
by "Nielsen BookData"