Printed circuit board materials handbook
Author(s)
Bibliographic Information
Printed circuit board materials handbook
（Electronic packaging and interconnection series）
McGraw-Hill, 1997
- :acid-free paper
Available at 1 libraries
Note
Includes bibliographical references and index
Description and Table of Contents
Description
Select PCB materials for top performing boardsFrom weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. Printed Circuit Board Materials Handbook gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card. Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to:
Master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resinsWork with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers Fabricate rigid and flexible printed wiring boards Apply the latest coating, laminating, etching, and electroplating methodsMaximize techniques for hot air leveling, microsection analysis and electrical testResolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysisMuch more
Table of Contents
Continuous Glass Fiber Reinforcement for Printed Wiring Board Application.Glass Reinforcement.Films, Polymide.Polyethylene Teraphthalate (PET) and Polyethylene Naphthalate (PEN) for Printed Circuit Application.Punching Grades of Copper Clad Laminates.Resins.Copper Foils.Anodes for Printed Wiring Plating.Prepreg and Laminates.Non-Woven Aramid Reinforcement.Drill Bits and Routers.Fabrication of Rigid Printed Wiring Boards.Fabrication of Flexible and Rigid Flexible Printed Wiring Boards.Photoresist.Etching Inner Layers.Oxide Coatings.Lamination of Rigid Multilayer Boards.Lamination of Flex and Rigid Flex Printed Wiring Boards.Entry and Back-Up Material.Drilling Rigid and Flexible Printed Wiring Boards.Desmear/Etchback Process.Plasma Etchback.Electroless Copper Process.Direct Metalization Process.Electroplating.Additive Copper.Etching Outer Layers.Photoimageable Soldermask.Screenable Solder Mask Coatings.Hot Air Leveling.Microsection Anaysis.Electrical Test.
by "Nielsen BookData"