Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee
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Bibliographic Information
Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee
（DE, vol. 105）
American Society of Mechanical Engineers, c1999
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Includes bibliographical references and author index
Description and Table of Contents
Description
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
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