Reliability, stress analysis, and failure prevention issues : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida
著者
書誌事項
Reliability, stress analysis, and failure prevention issues : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida
(DE, vol. 110)
American Society of Mechanical Engineers, c2000
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注記
Includes bibliographical references and author index
内容説明・目次
内容説明
Presents papers from a November 2000 meeting, covering techniques of measuring interface stress distributions in adhesively bonded joints and bolted connections. Covers modeling the weakened strength of disbonded interfaces with the use of line and spring elements, methods of elasto-plastic analysis
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