Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

著者

• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Kowalski, G. J.

書誌事項

Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]

（EEP, vol. 28）

American Society of Mechanical Engineers, c2000

注記

Includes bibliographic references and author index

• NII書誌ID(NCID): BA51029229
• ISBN:
  • 0791819302
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: vi, 300 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging Congresses
• 親書誌ID:
  • BA14250087