Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

著者

• International Symposium on Advanced Packaging Materials
• Wong, C. P.
• Garrou, Philip
• Morris, James E.
• International Microelectronics and Packaging Society

書誌事項

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. Morris

IMAPS , IEEE, [2000]

• :softbound

タイトル別名

Advanced packaging materials

proceedings International Symposium and Exhibition on Advanced Packaging Materials : processes, properities and interfaces

00TH8507

注記

"Refer to IEEE Catalog Number 00TH8507"--T.p. verso

Includes bibliographic references and index

詳細情報

• NII書誌ID(NCID): BA5105981X
• ISBN:
  • 0930815599
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Reston, Virginia,Piscataway, NJ
• ページ数/冊数: ix, 349 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials Congresses