Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

Author(s)

• International Symposium on Advanced Packaging Materials
• Wong, C. P.
• Garrou, Philip
• Morris, James E.
• International Microelectronics and Packaging Society

Bibliographic Information

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. Morris

IMAPS , IEEE, [2000]

• :softbound

Other Title

Advanced packaging materials

proceedings International Symposium and Exhibition on Advanced Packaging Materials : processes, properities and interfaces

00TH8507

Note

"Refer to IEEE Catalog Number 00TH8507"--T.p. verso

Includes bibliographic references and index

Details

• NCID: BA5105981X
• ISBN:
  • 0930815599
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Reston, Virginia,Piscataway, NJ
• Pages/Volumes: ix, 349 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Materials Congresses