Molecular adhesion and its applications : the sticky universe

書誌事項

Molecular adhesion and its applications : the sticky universe

Kevin Kendall

Kluwer Academic / Plenum Publishers, 2001

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注記

Includes bibliographical references and index

内容説明・目次

内容説明

At the beginning of the twentieth century, engineers and technologists would have recognized the importance of adhesion in two main aspects: First, in the display of friction between surfaces - at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials - principally wood-to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and certain pastes, they regarded them as materials of uncertain formulation, too impure to be amenable to precise experiment. Biological scientists were aware also of adhesive phenomena, but the science was supported by documentation rather than understanding. By the end of the century, adhesion and adhesives were playing a crucial and deliberate role in the formulation of materials, in the design and manufacture of engineering structures without weakening rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical scientists were aware that the states of matter, whether gas, liquid, or solid, were determined by the competition between thermal energy and int- molecular binding forces. Then the solid state had to be differentiated into crystals, amorphous glasses, metals, etc. , so the importance of the molecular attractions in determining stiffness and strength became clearer.

目次

Preface. Part I: Background and Fundamentals. 1. Introduction to molecular adhesion & fracture: the adhesion paradox. 2. Phenomenology of adhesion effects: fracture stranger than friction. 3. Theories and laws of molecular adhesion: all molecules adhere. Part II: Laws and Mechanisms. 4. Evidence for the first law of adhesion: surfaces leap into contact. 5. Intermolecular forces: the new geometry of computer modeling. 6. Evidence for the 2nd law of adhesion: contamination reduces adhesion. 7. Influence of the adhesion and fracture mechanism: the 3rd law. 8. More intricate mechanisms: raising and lowering adhesion. Part III: Applications and Benefits. 9. Adhesion of particles: deformation, friction and sintering. 10. Adhesion of colloids: dispersion, aggregation and flocculation. 11. Pastes and gels: effects of adhesion on structure and behaviour. 12. Adhesion of biological cells: the nature of slime. 13. Nano-adhesion: joining materials for electronic applications. 14. Films and layers: adhesion of coatings. 15. Fracture and toughness of engineering adhesive joints. 16. Composite materials: held together by adhesion at interfaces. 17. The future of molecular adhesion and the sticky universe. Index.

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詳細情報

  • NII書誌ID(NCID)
    BA52406726
  • ISBN
    • 0306465205
  • LCCN
    00049771
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    New York
  • ページ数/冊数
    xix, 429 p. ; ill. 24 cm
  • 分類
  • 件名
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