Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.

著者

    • Singh, Rajiv K

書誌事項

Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.

editors, Rajiv K. Singh ... [et al.]

(Materials Research Society symposium proceedings, v. 613)

Materials Research Society, c2001

大学図書館所蔵 件 / 4

この図書・雑誌をさがす

注記

Includes bibliographical references and indexes

内容説明・目次

内容説明

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.

「Nielsen BookData」 より

関連文献: 1件中  1-1を表示

詳細情報

  • NII書誌ID(NCID)
    BA52827327
  • ISBN
    • 1558995218
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Warrendale, PA
  • ページ数/冊数
    1 v.
  • 大きさ
    24 cm
  • 親書誌ID
ページトップへ