Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

Author(s)

• Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics. International Symposium
• Mathad, G. S.
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division
• Electrochemical Society. Electrodeposition Division
• Electrochemical Society. Meeting

Bibliographic Information

Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

editor, G.S. Mathad ; assistant editors, H.S. Rathore ... [et al.] ; [cosponsored by] Dielectric Science & Technology, Electronics, and Electrodeposition Divisions [of the Electrochemical Society]

（Proceedings / [Electrochemical Society], v. 2000-27, 2003-10）

Electrochemical Society, c2001-2003

• [I]
• II

Note

[I]:"The symposium, cosponsored by Dielectric Science & Technology, Electronics, and Electrodeposition Divisions, was held as part of the 198th meeting of The Electrochemical Society, Inc. in Phoenix, AZ, October 22-27, 2000"--on pref.

II:"..., was held as part of the 204th meeting of The Electrochemical Society, Inc. in Orlando, FL, October 12-17, 2003"--on pref

Includes bibliographical references and indexes

Details

• NCID: BA54501047
• ISBN:
  • 156677294X
  • 1566773903
• LCCN: 01086649
• LCCN: 200310702
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, N.J.
• Pages/Volumes: 2 v.
• Size: 24 cm
• Parent Bibliography ID:
  • BA01323290