Optical microscanners and microspectrometers using thermal bimorph actuators
著者
書誌事項
Optical microscanners and microspectrometers using thermal bimorph actuators
（Microsystems / series editor Stephen D. Senturia, 8）
Kluwer Academic Publishers, c2002
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
Optical Microscanners and Microspectrometers using Thermal Bimorph Actuators shows how to design and fabricate optical microsystems using innovative technologies and and original architectures. A barcode scanner, laser projection mirror and a microspectrometer are explained in detail, starting from the system conception, discussing simulations, choice of cleanroom technologies, design, fabrication, device test, packaging all the way to the system assembly.
An advanced microscanning device capable of one- and two-dimensional scanning can be integrated in a compact barcode scanning system composed of a laser diode and adapted optics. The original design of the microscanner combines efficiently the miniaturized thermal mechanical actuator and the reflecting mirror, providing a one-dimensional scanning or an unique combination of two movements, depending on the geometry. The simplicity of the device makes it a competitive component.
The authors rethink the design of a miniaturized optical device and find a compact solution for a microspectrometer, based on a tunable filter and a single pixel detector. A porous silicon technology combines efficiently the optical filter function with a thermal mechanical actuator on chip. The methodology for design and process calibration are discussed in detail. The device is the core component of an infrared gas spectrometer.
目次
Preface.
1. Introduction.
2. Basics for a thermally actuated micromirror.
3. Microscanner technology.
4. One-dimensional microscanner.
5. Two-dimensional microscanner.
6. Advanced Optical Filters of Porous Silicon.
7. Micromachining using porous Silicon.
8. Tunable Optical Filter and IR Gas Spectroscopy.
9. Conclusions and outlook.
Appendices. A.1: Complement to the curvature calculation due to residual stress. A.2: Complement to the static temperature distribution calculation. A.3: Large deflections.
References. Symbols and Abbreviations.
Glossary of terms. Acknowledgments.
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