RF measurements of die and packages
Author(s)
Bibliographic Information
RF measurements of die and packages
（The Artech House microwave library）
Artech House, c2002
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.
Table of Contents
Preface. Introduction, Calibration, Coplanar Probes. High-Volume Probing. Test Fixtures. On-Wafer Characterization. RF Test Systems. Package Characterization. Future Trends. Appendix.
by "Nielsen BookData"