ISTFA 2000 : proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington
著者
書誌事項
ISTFA 2000 : proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington
ASM International, c2000
- タイトル別名
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ISTFA 2000 : conference proceedings from the 26th International Symposium for Testing and Failure Analysis
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注記
Includes bibliographical references and index
EDFAS : Electronic Device Failure Analysis Society
内容説明・目次
内容説明
Proceedings of the 2000 International Symposium for Testing and Failure Analysis, held 12th-16th November, 2000, at Meydenbauer Convention Center, Belvue, Washington. These proceedings present in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures, by analyzing the silicon. Contents: Advanced Techniques; Packaging; Testing and Yield Enhancement; Backside Analysis; New Techniques; Case Histories; Focused Ion Beam Analysis; Scanning Probe Microscopy Analysis. The CD-ROMAs PDF-file format can be accessed using Adobe Acrobat Reader 4.0 or higher.
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