Silicon wafer bonding technology : for VLSI and MEMS applications

Author(s)

• Iyer, Subramanian S.
• Auberton-Hervé, Andre J

Bibliographic Information

Silicon wafer bonding technology : for VLSI and MEMS applications

edited by Subramanian S. Iyer and Andre J. Auberton-Hervé

（EMIS processing series / Series advisor B.L. Weiss, no. 1）

INSPEC, The Institution of Electrical Engineers, c2002

Note

Includes bibliographical references and index

This series is designed to complement the EMIS datareviews series.--from added T.P.

Details

• NCID: BA59161161
• ISBN:
  • 0852960395
• Country Code: uk
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: London
• Pages/Volumes: xxv, 149 p
• Size: 26 cm
• Classification:
  • DC21 : 621.38152
• Subject Headings:
  • LCSH : Silicon-on-insulator technology
  • LCSH : Integrated circuits -- Very large scale integration
  • LCSH : Microelectromechanical systems
• Parent Bibliography ID:
  • BA59159716