Silicon wafer bonding technology : for VLSI and MEMS applications

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Silicon wafer bonding technology : for VLSI and MEMS applications

edited by Subramanian S. Iyer and Andre J. Auberton-Hervé

（EMIS processing series / Series advisor B.L. Weiss, no. 1）

INSPEC, The Institution of Electrical Engineers, c2002

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Includes bibliographical references and index

This series is designed to complement the EMIS datareviews series.--from added T.P.

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