Fatigue life prediction of solder joints in electronic packages with ANSYS

Author(s)
    • Madenci, Erdogan
    • Guven, Ibrahim
    • Kilic, Bahattin
Bibliographic Information

Fatigue life prediction of solder joints in electronic packages with ANSYS

by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

(The Kluwer international series in engineering and computer science, 719)

Kluwer Academic, c2003

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CD-ROM in pocket attached to inside back cover

Includes bibliographical references and index

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