Fatigue life prediction of solder joints in electronic packages with ANSYS
Author(s)
Bibliographic Information
Fatigue life prediction of solder joints in electronic packages with ANSYS
(The Kluwer international series in engineering and computer science, 719)
Kluwer Academic, c2003
Available at 2 libraries
  Aomori
  Iwate
  Miyagi
  Akita
  Yamagata
  Fukushima
  Ibaraki
  Tochigi
  Gunma
  Saitama
  Chiba
  Tokyo
  Kanagawa
  Niigata
  Toyama
  Ishikawa
  Fukui
  Yamanashi
  Nagano
  Gifu
  Shizuoka
  Aichi
  Mie
  Shiga
  Kyoto
  Osaka
  Hyogo
  Nara
  Wakayama
  Tottori
  Shimane
  Okayama
  Hiroshima
  Yamaguchi
  Tokushima
  Kagawa
  Ehime
  Kochi
  Fukuoka
  Saga
  Nagasaki
  Kumamoto
  Oita
  Miyazaki
  Kagoshima
  Okinawa
  Korea
  China
  Thailand
  United Kingdom
  Germany
  Switzerland
  France
  Belgium
  Netherlands
  Sweden
  Norway
  United States of America
Note
CD-ROM in pocket attached to inside back cover
Includes bibliographical references and index
Description and Table of Contents
Description
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS (R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS (R) to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Table of Contents
Preface. List of Commands. List of Tables. List of Figures. 1: Introduction. 1.1. Numerical Modeling with Finite Element Analysis. 1.2. Constitutive Relations. 1.3. Failure Prediction. 1.4. References. 2: Thermomechanical Fatigue Life Prediction Analysis. 2.1. Approach. 2.2. Analysis Steps. 2.3. Case Study: BGA-Type Package. 2.4. References. 3: Mechanical Bending Fatigue Life Prediction Analysis. 3.1. Approach. 3.2. Analysis Steps. 3.3. Case Study: BGA-Type Package. 3.4. References. 4: Macro Reference Library. 4.1. Overview. 4.2. Preprocessor. 4.3. Solution. 4.4. Postprocessing. 4.5. References. Appendix A: Installation and Execution. A.1: Steps for ReliANS Installation on a PC Platform. A.2: Steps for Adding Working Directories for Use in ReliANS. A.3: Demonstration of ReliANS Installation and Adding New Directories. A.4: Installation of ReliANS on UNIX Systems. Appendix B: Input Listings for Case Studies. B.1: Input Listing for the Case Study Given in Chapter 2. B.2: Input Listing for the Case Study Given in Chapter 3. Index.
by "Nielsen BookData"