Fatigue life prediction of solder joints in electronic packages with ANSYS

Author(s)

• Madenci, Erdogan
• Guven, Ibrahim
• Kilic, Bahattin

Bibliographic Information

Fatigue life prediction of solder joints in electronic packages with ANSYS

by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

（The Kluwer international series in engineering and computer science, 719）

Kluwer Academic, c2003

Note

CD-ROM in pocket attached to inside back cover

Includes bibliographical references and index

• NCID: BA61879503
• ISBN:
  • 1402073305
• LCCN: 2000238928
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Boston, Mass. ; London
• Pages/Volumes: xx, 185 p.
• Size: 25 cm.
• Attached Material: 1 CD-ROM (4 3/4 in.)
• Classification:
  • DC21 : 621.381046
• Subject Headings:
  • LCSH : Electronic packaging -- Computer-aided design
  • LCSH : Solder and soldering -- Quality control
  • LCSH : Metals -- Fatigue
  • LCSH : Service life (Engineering) -- Forecasting
  • LCSH : ANSYS (Computer system)
• Parent Bibliography ID:
  • BA0004729X