Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

Author(s)

• International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics
• Mathad, G. S.
• Baker, B. C.
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division
• Electrochemical Society. Electrodeposition Division
• Electrochemical Society. Meeting

Bibliographic Information

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition

（Proceedings / [Electrochemical Society], v. 2002-22）

Electrochemical Society, c2003

Note

"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on pref

Includes bibliographical references and indexes

Details

• NCID: BA62538202
• ISBN:
  • 1566773792
• LCCN: 2003103319
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, N.J.
• Pages/Volumes: ix, 346 p.
• Size: 24 cm
• Parent Bibliography ID:
  • BA01323290