Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

書誌事項

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition

(Proceedings / [Electrochemical Society], v. 2002-22)

Electrochemical Society, c2003

大学図書館所蔵 件 / 1

この図書・雑誌をさがす

注記

"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on pref

Includes bibliographical references and indexes

関連文献: 1件中  1-1を表示

  • Proceedings

    [Electrochemical Society]

    Electrochemical Society

詳細情報

  • NII書誌ID(NCID)
    BA62538202
  • ISBN
    • 1566773792
  • LCCN
    2003103319
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Pennington, N.J.
  • ページ数/冊数
    ix, 346 p.
  • 大きさ
    24 cm
  • 親書誌ID
ページトップへ