Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

著者

• International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics
• Mathad, G. S.
• Baker, B. C.
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division
• Electrochemical Society. Electrodeposition Division
• Electrochemical Society. Meeting

書誌事項

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

editor, G.S. Mathad ; assistant editors, B.C. Baker ... [et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics, Electrodeposition

（Proceedings / [Electrochemical Society], v. 2002-22）

Electrochemical Society, c2003

注記

"... was held as part of the 202nd Meeting of the Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--on pref

Includes bibliographical references and indexes

詳細情報

• NII書誌ID(NCID): BA62538202
• ISBN:
  • 1566773792
• LCCN: 2003103319
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Pennington, N.J.
• ページ数/冊数: ix, 346 p.
• 大きさ: 24 cm
• 親書誌ID:
  • BA01323290