Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
著者
書誌事項
Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
（Materials Research Society symposium proceedings, v. 767）
Materials Research Society, c2003
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注記
Includes bibliographical references and indexes
内容説明・目次
内容説明
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
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