Lead-free soldering in electronics : science, technology, and environmental impact

書誌事項

Lead-free soldering in electronics : science, technology, and environmental impact

edited by Katsuaki Suganuma

Marcel Dekker, c2004

大学図書館所蔵 件 / 1

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注記

Includes bibliographical references and index

内容説明・目次

内容説明

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

目次

Introduction to Lead-Free Soldering Technology, K. Suganuma Materials Science Concepts in Lead-Free Soldering, C. Handwerker, U. Kattner, and K. Moon Alloy Selections, K. Nimmo Plating Lead-Free Soldering in Electronics, H. Nawafune Tin Whisker Discovery and Research, Y. Zhang Mechanical Evaluation in Electronics, W.J. Plumbridge Electrochemical Migration, H. Tanaka Lead-Free Solder Paste and Reflow Soldering, S. Fujiuchi Wave Soldering, T. Nishimura Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection, M. Hirano Future of Lead-Free Soldering, K. Suganuma Index

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詳細情報

  • NII書誌ID(NCID)
    BA65672482
  • ISBN
    • 0824741021
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    New York
  • ページ数/冊数
    x, 342 p.
  • 大きさ
    24 cm
  • 分類
  • 件名
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