Chemical-mechanical planarization of semiconductor materials

著者

• Oliver, M. R. (Michael R.)

書誌事項

Chemical-mechanical planarization of semiconductor materials

M.R. Oliver (ed.)

（Springer series in materials science, v. 69）

Springer, c2004

注記

Includes bibliographical references and index

内容説明・目次

内容説明

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

目次

1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA65818089
• ISBN:
  • 3540431810
• LCCN: 2003059075
• 出版国コード: gw
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Berlin ; Tokyo
• ページ数/冊数: x, 425 p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7871.85
  • DC22 : 621.3815/2
• 件名:
  • LCSH : Semiconductors -- Materials
  • LCSH : Grinding and polishing
• 親書誌ID:
  • BA00476831