Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

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Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics

（Proceedings / [Electrochemical Society], v. 2003-13）

Electrochemical Society, c2003

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Includes bibliographical references and indexes

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    [Electrochemical Society]

    Electrochemical Society

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