Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

Author(s)

• Mathad, G. S.
• Cale, T. S.
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division

Bibliographic Information

Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics

（Proceedings / [Electrochemical Society], v. 2003-13）

Electrochemical Society, c2003

Note

Includes bibliographical references and indexes

Details

• NCID: BA6623218X
• ISBN:
  • 1566773938
• LCCN: 2003109518
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, N.J.
• Pages/Volumes: x, 424 p.
• Size: 24 cm
• Classification:
  • LCC : TK7872.T55
  • DC21 : 621.3815/2
• Subject Headings:
  • LCSH : Thin film devices -- Design and construction -- Congresses
  • LCSH : Thin films -- Congresses
• Parent Bibliography ID:
  • BA01323290