Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2003

Author(s)

• International Symposium on the Physical & Failure Analysis of Integrated Circuits
• Thong, John T. L.
• IEEE Singapore Section. Reliability/CPMT/EDA Chapter
• IEEE Electron Devices Society
• National University of Singapore. Centre for IC Failure Analysis and Reliability
• IEEE Reliability Society
• Trigg, Alastair
• Chan, Daniel
• Ho, Philip

Bibliographic Information

Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2003

edited by Philip HO ... [et al.] ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE Electron Devices Society, IEEE Reliability Society ; in co-operation with Centre for IC Failure Analysis & Reliability, National University of Singapore

IEEE Operations Center, c2003

Other Title

10th International Symposium on the Physical & Failure Analysis of Integrated Circuits 2003

IPFA 2003 proceedings

03TH8662

Note

"IEEE catalog number 03TH8662"--T.p. verso

Includes bibliographical references and index

"7 to 11 July 2003, Singapore" in cover

Other editors : Alastair Trigg, Daniel Chan, John Thong

Description and Table of Contents

Description

This text covers topics on: advanced failure analysis techniques; advanced interconnects; dielectrics and hot-carrier reliabilty; EOS/ESD and CMOS latchup; practical issues in building-in reliability; and reliability and failure analysis in specialist devices.

by "Nielsen BookData"

Details

• NCID: BA66599934
• ISBN:
  • 0780377222
• LCCN: 2002115581
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Piscataway, N.J.
• Pages/Volumes: 216 p.
• Size: 30 cm