{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BA66631855.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BA66631855#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BA66631855.json"},"dc:title":[{"@value":"2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices : SISPAD 2003, 3-5 September 2003,Boston Massachusetts USA"}],"dcterms:alternative":["SISPAD 2003","03TH8679"],"dc:creator":"sponsored by IEEE Electron Devices Society","dc:publisher":[{"@value":"IEEE Service Center"}],"dcterms:extent":"x, 329 p.","cinii:size":"28 cm","dc:language":"eng","dc:date":"2003","cinii:ncid":"BA66631855","cinii:ownerCount":"1","foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DA02627989#entity","@type":"foaf:Person","foaf:name":[{"@value":"International Conference on Simulation of Semiconductor Devices and Processes"}]},{"@id":"https://ci.nii.ac.jp/author/DA01257512#entity","@type":"foaf:Person","foaf:name":[{"@value":"IEEE Electron Devices Society"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA000106","@type":"foaf:Organization","foaf:name":"東京科学大学 大岡山図書館","rdfs:seeAlso":{"@id":"https://topics.libra.titech.ac.jp/recordID/catalog.bib/BA66631855"}}],"bibo:lccn":["2003101508"],"rdfs:seeAlso":[{"@id":"https://lccn.loc.gov/2003101508"}],"prism:publicationDate":["c2003"],"cinii:note":["\"IEEE catalog number 03TH8679\"--T.p. verso","Includes bibliograhical references and index"],"dcterms:hasPart":[{"@id":"urn:isbn:0780378261"}]}]}