書誌事項

Polymers for microelectronics and nanoelectronics

editors, Qinghuang Lin, Raymond A. Pearson, Jeffrey C. Hedrick

(ACS symposium series, 874)

American Chemical Society, c2004

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注記

"This book is based on selected papers from the American Chemical Society (ACS) symposium entitled Polymers for Micro- and Nanoelectronics held August 18-22, 2002 in Boston, Massachusetts"--Preface

"ACS Division of Polymeric Materials: Science and Engineering (PMSE) for sponsoring the symposium"--Preface

Includes bibliographical references and index

内容説明・目次

内容説明

Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.

目次

Preface 1: Zhenan Bao: Recent Progress in Materials for Organic Electronics 2: Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi: PPV Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects Derived Therefrom 3: M.E. van der Boom and T.J. Marks: Layer-by-Layer Assembly of Molecular Materials for Electrooptical Applications 4: Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing: Oxidative Solid-State Cross-Linking of Polymer Precursors to Pattern Intrinsically Conducting Polymers 5: T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin, A. Cabral, and J. Curtin: Fluorocarbon Polymer-Based Photoresists for 157-nm Lithography 6: Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seichi Ishikawa, Naomi Shida, and Minoru Toriumi: 157-nm Resist Materials Using Main-Chain Fluorinated Polymers 7: Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K. Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie Angelopoulos: Correlation of the Reaction Front with Roughness in Chemically Amplified Photoresists 8: Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L. Goldfarb, and Marie Angelopoulos: Utilizing Near Edge X-ray Absorption Fine Structure to Probe Interfacial Issues in Photolithography 9: B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R. Seidel, A. Gorbunoff, W. Pompe, and M. Mertig: Photolabile Ultrathin Polymer Films for Spatially Defined Attachment of Nano Elements 10: Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick Theato, and Anke Helfer: Soft Lithography on Block Copolymer Films: Generating Functionalized Patterns on Block Copolymer Films as a Basis to Further Surface Modification 11: R.D. Miller, W. Volksen, V.Y. Lee, E. Conner, T. Magbitang, R. Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M. Tooney, Q.R. Huang, C.W. Frank, and H.-C. Kim: Nanoporous, Low-Dielectric Constant Organosilicate Materials Derived from Inorganic Polymer Blends 12: C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S. Cohen, K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C. Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio: Porous Low-k Dielectrics: Material Properties 13: Bianxiao Zhong and Eric S. Moyer: Ultra Low-k Dielectic Films with Ultra Small Pores Using Poragens Chemically Bonded to Silozane Resin 14: H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J. Kern, Joan G. Marshall, Karin Syverud, and Mary Leff: Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices 15: Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H. Townsend: Molecular Brushes as Templating Agents for Nanoporous SiLK* Dielectric Films 16: Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei Liu, Barry J. Bauer, and Wen-li Wu: X-ray Reflectivity as a Metrology to Characterize Pores in Low-k Dielectric Films 17: Sara N. Paisner and Joseph M. DeSimone: Micro- and Nanoporous Materials Developed Using Supercritical CO2: Novel Synthetic Methods for the Development of Micro- and Nanoporous Materials Toward Microelectronic Applications 18: Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki Okamura, and Masahiro Tsunooka: Thermally Degradable Photocross-Linking Polymers 19: Robert K. Oldak and Raymond A. Pearson: Evaluation of Infrared Spectroscopic Techniques to Assess Molecular Interactions 20: Zhuqing Zhang and C.P. Wong: Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications 21: Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba: Benzocyclobutene-Based Polymers for Microelectronic Applications 22: A.L.Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein: Formation of Nanocomposites by In Situ Intercalative Polymerization of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR Study Author Index Subject Index

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