MEMS packaging
Author(s)
Bibliographic Information
MEMS packaging
（EMIS processing series / Series advisor B.L. Weiss, no. 3）
INSPEC, Institution of Electrical Engineers, c2004
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.
Aimed at professional engineers, scientists and technologists from industry, research laboratories and universities, the book examines every aspect of the assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in the key industries of life sciences, telecommunication and aerospace engineering. The authors cover key topics such as bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, RF telecommunications and aerospace applications.
Table of Contents
Chapter 1: Fundamentals of MEMS packaging
Chapter 2: Joining and bonding technologies
Chapter 3: Sealing technologies
Chapter 4: Packaging of microsystems
Chapter 5: Automated micro assembly
Chapter 6: Testing and design for test
Chapter 7: MEMS packaging in the life sciences
Chapter 8: RF and optical packaging telecommunications and other applications
Chapter 9: Aerospace applications
by "Nielsen BookData"
