Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

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Bibliographic Information

Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

editors, Sean G. Corcoran ... [et al.]

(Materials Research Society symposium proceedings, v. 795)

Materials Research Society, c2004

Other Title

Thin films : stresses and mechanical properties 10

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Note

Includes bibliographical references and indexes

Description and Table of Contents

Description

Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

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Details

  • NCID
    BA66862745
  • ISBN
    • 1558997334
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Warrendale, Pa.
  • Pages/Volumes
    xvii, 583 p.
  • Size
    24 cm
  • Parent Bibliography ID
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