Handbook of lead-free solder technology for microelectronic assemblies
Author(s)
Bibliographic Information
Handbook of lead-free solder technology for microelectronic assemblies
（Mechanical engineering, 170）
M. Dekker, c2004
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Table of Contents
Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations.
by "Nielsen BookData"
