Materials, integration and packaging issues for high-frequency devices

著者

• Materials Research Society

書誌事項

Materials, integration and packaging issues for high-frequency devices

（Materials Research Society symposium proceedings, v. 783, 833）

Materials Research Society, c2004-

• [1]
• 2

注記

Includes bibliographical references and indexes

1st symposium was held in December 1-3, 2003, Boston, Massachusetts, U.S.A.

2nd symposium was held in November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

詳細情報

• NII書誌ID(NCID): BA67311055
• ISBN:
  • 1558997210
  • 1558997814
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Warrendale, Pa.
• ページ数/冊数: v.
• 大きさ: 24 cm
• 親書誌ID:
  • BA00013775